FCM 10000 & CMTI
The All in One Flip Chip IC Module Production System
Mühlbauer's FCM 10000 is characterized by its compact design, high production output and outstanding cost efficiency. This system assembles the module tapes with chips directly from the wafer using Mühlbauer's proven flip-chip technology. A placement accuracy of ± 35 µm and a throughput of up to 8,500 UPH can be achieved - this corresponds to an annual capacity of up to 50 million modules.
The CMT is integrated inline into the FCM 10000 and enables fully automated optical and electrical inspection. The CMT offers full control over chip placement with high-precision optical measurement of position, size and contamination of the underside of the chip (depending on adhesive type and contrast). In addition, an electrical test station can be integrated for ATR and functional tests as well as for pre-personalization. Defective IC modules are clearly identified by a reject punch.
The 100% optical inspection during each bonding process guarantees the highest production quality.
KEY FEATURES
- All-in-one solution
- High-speed flip chip assembly of up to 8,500 UPH
- High placement accuracy of ±35µm
- A compact production & high-speed inspection line for IC modules
- Optical & electrical quality control of the finished product
DESIGN
- Highly secure access control with individual operator & service identification
- Menu-driven software, available in different languages
- Storage of process data
- Vacuum fixation of the belt at the inspection position
- Input & output IC module counter
- Detailed production data report (good/reject modules)
THROUGHPUT
- Up to 8,500 modules per hour (depending on process specification)
Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany
Phone: +49 9461 952 0
Fax: +49 9461 952 1101
